WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE:

Join a dynamic global team dedicated to advancing reliability testing for component, board, and system levels of AMD's cutting-edge processor and accelerator products. Collaborate closely with cross-functional teams across AMD Global Operations & Quality, business units, and worldwide supplier network. This leadership role focuses on pioneering advanced reliability metrology, driving board and system-level reliability initiatives, and delivering impactful programs that ensure exceptional product quality and reliability for AMD.

THE PERSON:

• Ability to develop innovative and effective solutions for complex technical challenges by identifying critical gaps, formulating actionable strategies, and making sound, simplifying assumptions. Adept at delivering results under significant time constraints, balancing analytical rigor with practical decision-making to drive timely and impactful outcomes.
• Demonstrates a strong understanding of product reliability, in the context of mechanical, thermal, and electrical stresses, ensuring the integrity and longevity of modules and board assemblies in diverse operational environments.
• Good knowledge of advanced packaging technologies, including 2.5D, 3D, and chiplet architectures, as well as experience in module and system board reliability, power component, and chip-package-board interactions.

KEY RESPONSIBILITIES:

• Lead advanced thermal/mechanical reliability team. Architect, design, and develop advanced reliability test methodologies for comprehensive quality and reliability assessments. Areas of focus include reliability for high-power devices and system thermal/mechanical reliability.
• Design and execute thermal/mechanical reliability tests, including thermal cycling, power cycling, and temperature/ humidity cyclic testing. Validate thermal/mechanical models with empirical data and assess failure mechanisms related to reliability stresses, such as solder joint fatigue, delamination, and electro-migration.

• Evaluate thermal/mechanical properties of packaging materials (e.g., substrates, under-fills, TIMs) and their impact on reliability. Collaborate with material suppliers to select and qualify materials for thermal/mechanical performance and reliability.

• Perform electro-migration (EM) and IR-Drop (Joule heating) testing and analysis across advanced packaging technologies and PCB domains, with a focus on high current-carrying structures in component, package and board. Responsible for designing and implementing comprehensive test methodologies to assess the impact of EM and IR-Drop on device performance and reliability, ensuring robust evaluation and optimization of critical system components.
• Collaborate closely with board, module, and system reliability teams to conduct system reliability testing. Responsible for assessing, evaluating, and establishing innovative testing methodologies to enhance efficiency and effectiveness in reliability evaluations at the component, module, board, and system levels.
• Leverage advanced diagnostic tools, e.g., FA and package characterization tools, and analytical techniques to identify failure mechanisms, assess component, board, and system robustness, and provide actionable insights for optimization and risk mitigation.

• Work with international colleagues and suppliers for relevant reliability testing on incoming critical components.
• Collaborate with cross-functional teams on failure root cause investigation and drive continued improvement plans.

PREFERRED EXPERIENCE:

• Minimum 10 years of experience in advanced reliability testing and analysis, and other relevant experience.
• Proficient and knowledgeable in advanced package technologies (2.5D, 3D, 3.5D) - design, BOM, assembly, and quality/reliability. Experience in integration and interaction of packaging-board assembly, quality and reliability value-chains.
• Skilled in applying statistical methodologies to analyze reliability data, model failure rates, and predict product lifespans. Proficient in leveraging these metrics to identify trends, ensure compliance with industry standards, and drive improvements in product quality and reliability.
• Experienced in electro-migration and IR-Drop in advanced packaging and board integration.
• Knowledgeable in advanced diagnostic and failure analysis tools, and analytical techniques to identify failure modes and mechanisms.
• Strong analytical/problem-solving skills and pronounced attention to details with statistical knowledge.
• Must be a self-starter and leader, able to independently drive tasks to completion.
• Ability to structure and execute complex analysis, draw insights, and communicate summary conclusions/recommendations to senior management and AMD customers and partners.
• Ability to network, build relationships, and collaborate to drive effective decision-making across multiple functions and levels within AMD.
• Possesses strong interpersonal skills with a proven ability to establish leadership within areas of expertise. Effectively mentors engineers, providing guidance in both technical domains and professional skill development to foster growth and team success.
• Experience with Linux Systems, and programming/scripting skills (e.g. C/C++, Python) is a plus.

ACADEMIC CREDENTIALS:

• PhD, Meng/BEng (MS/BS) in Mechanical engineering and Material engineering.

LOCATION:

Singapore

#LI-JV1

#LI-Hybrid

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE:

Join a dynamic global team dedicated to advancing reliability testing for component, board, and system levels of AMD's cutting-edge processor and accelerator products. Collaborate closely with cross-functional teams across AMD Global Operations & Quality, business units, and worldwide supplier network. This leadership role focuses on pioneering advanced reliability metrology, driving board and system-level reliability initiatives, and delivering impactful programs that ensure exceptional product quality and reliability for AMD.

THE PERSON:

• Ability to develop innovative and effective solutions for complex technical challenges by identifying critical gaps, formulating actionable strategies, and making sound, simplifying assumptions. Adept at delivering results under significant time constraints, balancing analytical rigor with practical decision-making to drive timely and impactful outcomes.
• Demonstrates a strong understanding of product reliability, in the context of mechanical, thermal, and electrical stresses, ensuring the integrity and longevity of modules and board assemblies in diverse operational environments.
• Good knowledge of advanced packaging technologies, including 2.5D, 3D, and chiplet architectures, as well as experience in module and system board reliability, power component, and chip-package-board interactions.

KEY RESPONSIBILITIES:

• Lead advanced thermal/mechanical reliability team. Architect, design, and develop advanced reliability test methodologies for comprehensive quality and reliability assessments. Areas of focus include reliability for high-power devices and system thermal/mechanical reliability.
• Design and execute thermal/mechanical reliability tests, including thermal cycling, power cycling, and temperature/ humidity cyclic testing. Validate thermal/mechanical models with empirical data and assess failure mechanisms related to reliability stresses, such as solder joint fatigue, delamination, and electro-migration.

• Evaluate thermal/mechanical properties of packaging materials (e.g., substrates, under-fills, TIMs) and their impact on reliability. Collaborate with material suppliers to select and qualify materials for thermal/mechanical performance and reliability.

• Perform electro-migration (EM) and IR-Drop (Joule heating) testing and analysis across advanced packaging technologies and PCB domains, with a focus on high current-carrying structures in component, package and board. Responsible for designing and implementing comprehensive test methodologies to assess the impact of EM and IR-Drop on device performance and reliability, ensuring robust evaluation and optimization of critical system components.
• Collaborate closely with board, module, and system reliability teams to conduct system reliability testing. Responsible for assessing, evaluating, and establishing innovative testing methodologies to enhance efficiency and effectiveness in reliability evaluations at the component, module, board, and system levels.
• Leverage advanced diagnostic tools, e.g., FA and package characterization tools, and analytical techniques to identify failure mechanisms, assess component, board, and system robustness, and provide actionable insights for optimization and risk mitigation.

• Work with international colleagues and suppliers for relevant reliability testing on incoming critical components.
• Collaborate with cross-functional teams on failure root cause investigation and drive continued improvement plans.

PREFERRED EXPERIENCE:

• Minimum 10 years of experience in advanced reliability testing and analysis, and other relevant experience.
• Proficient and knowledgeable in advanced package technologies (2.5D, 3D, 3.5D) - design, BOM, assembly, and quality/reliability. Experience in integration and interaction of packaging-board assembly, quality and reliability value-chains.
• Skilled in applying statistical methodologies to analyze reliability data, model failure rates, and predict product lifespans. Proficient in leveraging these metrics to identify trends, ensure compliance with industry standards, and drive improvements in product quality and reliability.
• Experienced in electro-migration and IR-Drop in advanced packaging and board integration.
• Knowledgeable in advanced diagnostic and failure analysis tools, and analytical techniques to identify failure modes and mechanisms.
• Strong analytical/problem-solving skills and pronounced attention to details with statistical knowledge.
• Must be a self-starter and leader, able to independently drive tasks to completion.
• Ability to structure and execute complex analysis, draw insights, and communicate summary conclusions/recommendations to senior management and AMD customers and partners.
• Ability to network, build relationships, and collaborate to drive effective decision-making across multiple functions and levels within AMD.
• Possesses strong interpersonal skills with a proven ability to establish leadership within areas of expertise. Effectively mentors engineers, providing guidance in both technical domains and professional skill development to foster growth and team success.
• Experience with Linux Systems, and programming/scripting skills (e.g. C/C++, Python) is a plus.

ACADEMIC CREDENTIALS:

• PhD, Meng/BEng (MS/BS) in Mechanical engineering and Material engineering.

LOCATION:

Singapore

#LI-JV1

#LI-Hybrid